Double-gated ferroelectric field-effect transistor

ABSTRACT

A ferroelectric field-effect transistor (FeFET) includes first and second gate electrodes, source and drain regions, a semiconductor region between and physically connecting the source and drain regions, a first gate dielectric between the semiconductor region and the first gate electrode, and a second gate dielectric between the semiconductor region and the second gate electrode. The first gate dielectric includes a ferroelectric dielectric. In an embodiment, a memory cell includes this FeFET, with the first gate electrode being electrically connected to a wordline and the drain region being electrically connected to a bitline. In another embodiment, a memory array includes wordlines extending in a first direction, bitlines extending in a second direction, and a plurality of such memory cells at crossing regions of the wordlines and the bitlines. In each memory cell, the wordline is a corresponding one of the wordlines and the bitline is a corresponding one of the bitlines.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/640,467, filed on Feb. 20, 2020, which is a U.S. National PhaseApplication under 35 U.S.C. § 371 of International Application No.PCT/US2017/054538, filed Sep. 29, 2017, entitled “DOUBLE-GATEDFERROELECTRIC FIELD-EFFECT TRANSISTOR,” which designates the UnitedStates of America, the entire disclosure of which are herebyincorporated by reference in their entirety and for all purposes.

BACKGROUND

Embedded dynamic random-access memory (eDRAM) and embedded static RAM(eSRAM) consume a significant area because of being transistor-pitchlimited. Ferroelectric memory can be used as a nonvolatile DRAM andeDRAM replacement memory. Ferroelectric field effect transistor (FeFET)memory can suffer from degrading effects such as a poor sense margin dueto factors such as the gate dielectric interface being compromised. Forexample, not all channel materials form ideal interfaces withferroelectric materials.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of an example ferroelectric fieldeffect transistor (FeFET), according to an embodiment of the presentdisclosure.

FIG. 2 is a cross-sectional view of an example FeFET, according toanother embodiment of the present disclosure.

FIG. 3 is a cross-sectional view of an example embedded memory,according to an embodiment of the present disclosure.

FIG. 4 is an example voltage curve comparison for driving a FeFET inthree different states, according to an embodiment of the presentdisclosure.

FIG. 5 is a schematic plan view of an example embedded memoryconfiguration, according to an embodiment of the present disclosure.

FIG. 6A is a plan view of an example layout of an embedded memorywithout overlap of the memory array and memory peripheral circuit.

FIGS. 6B-6C are plan views of an example layout of an embedded memorywith overlap of the memory array and memory peripheral circuit,according to an embodiment of the present disclosure.

FIG. 7 illustrates an example method of fabricating a FeFET-basedembedded memory, according to an embodiment of the present disclosure.

FIG. 8 illustrates an example computing system implemented with theintegrated circuit structures or techniques disclosed herein, accordingto an embodiment of the present disclosure

These and other features of the present embodiments will be understoodbetter by reading the following detailed description, taken togetherwith the figures herein described. In the drawings, each identical ornearly identical component that is illustrated in various figures may berepresented by a like numeral. For purposes of clarity, not everycomponent may be labeled in every drawing. Furthermore, as will beappreciated, the figures are not necessarily drawn to scale or intendedto limit the described embodiments to the specific configurations shown.For instance, while some figures generally indicate straight lines,right angles, and smooth surfaces, an actual implementation of thedisclosed techniques may have less than perfect straight lines and rightangles, and some features may have surface topography or otherwise benon-smooth, given real-world limitations of fabrication processes. Inshort, the figures are provided merely to show example structures.

DETAILED DESCRIPTION

According to various embodiments of the present disclosure, aferroelectric FET (FeFET) includes two gates (such as separatelycontrollable gates) to improve the sensing margin of the FeFET. In someembodiments, the double-gated one-transistor (1T) FeFET cell improvesshort-channel control (subthreshold swing) in metal oxide semiconductorFET (MOSFET) devices, such as memory devices. In some embodiments, thisresults in better current on-off ratio, which helps with detectabilityof separate states when used as a memory system.

In further detail, a ferroelectric material is organized in latticesthat switch polarization between parallel and anti-parallel states on alattice-by-lattice basis. When a sufficient number of such lattices(e.g., all or most of them) are polarized in the same state (parallel oranti-parallel), the material itself is referred to as being in thatstate (parallel or anti-parallel). This change in the internalpolarization is brought about at positive and negative voltages known ascoercive voltages or fields. This introduces different amounts ofpolarization and polarity of charge inside the ferroelectric. Thischange in the charge in the ferroelectric creates a built-in field. Whenused as a gate dielectric material, this ferroelectric field can bethought of as a charged capacitor. For example, a positive coercivevoltage can be used to switch or program the ferroelectric material intothe parallel state (e.g., all or most of the lattices in the parallelstate), while a negative coercive voltage can be used to switch orprogram the ferroelectric material into the anti-parallel state (e.g.,all or most of the lattices in the anti-parallel state). For reference,an otherwise unbiased ferroelectric material can be such a material withabout half of the lattices in the parallel state and the other half inthe anti-parallel state.

Further, when this ferroelectric material is in contact with thesemiconductor channel in a transistor (e.g., as a gate dielectric), thethreshold voltage of the transistor changes depending on the directionof polarization (parallel or antiparallel), the value of thepolarization field, and the value of the coercive field. According tosome embodiments, suitable ferroelectric materials include one or moreof lead zirconate titanate (PZT), hafnium zirconium oxide (HZO), bariumtitanate (BaTiO₃), lead titanate (PbTiO₃), and doped hafnium dioxide(HfO₂). The doped HfO₂ can include one or more of silicon-doped HfO₂,yttrium-doped HfO₂, and aluminum-doped HfO₂.

Single-gate FeFET techniques can be prone to problems. For example, inn-type thin-film semiconductor FeFET circuits, there can be a need for ahigher effective coercive field to depolarize the ferroelectricmaterial. Further, polarization near the contacts can often never bechanged back. In addition, the read operation is slow because of lowtransconductance. Furthermore, the read and write operations cannot besimultaneous. In such techniques, the voltage window can suffer due topoor gate control and subthreshold slope. In addition, there is often aneed for another transistor to prevent depolarization during the readoperation.

Accordingly, in one or more embodiments of the present disclosure, aferroelectric material is incorporated in one of the gate oxide layersof a double-gate MOSFET. The two gates can be independently driven. Insome embodiments, the ferroelectric material is in the top gate oxidewhile the bottom gate (with a linear dielectric, such as a high-kdielectric) is used for read operations. In such embodiments, read andwrite operations can operate independently. Further, higher gate fieldscan be achieved by driving both gates concurrently (e.g.,simultaneously), which can lead to boosted write fields and erasefields. In addition, the depolarization field is mitigated, as thetransistor does not need to be accessed.

In one or more embodiments of the present disclosure, a double-gatedFeFET is provided. In one or more embodiments of the present disclosure,a double-gated backend 1T-FeFET memory cell is provided. According toone embodiment, a ferroelectric field-effect transistor (FeFET) includesfirst and second gate electrodes, source and drain regions, asemiconductor region between and physically connecting the source anddrain regions, a first gate dielectric between the semiconductor regionand the first gate electrode, and a second gate dielectric between thesemiconductor region and the second gate electrode. The first gatedielectric includes a ferroelectric dielectric. In another embodiment, amemory cell includes this FeFET, with the first gate electrode beingelectrically connected to a first wordline and one of the source anddrain regions being electrically connected to a bitline. In yet anotherembodiment, a memory array includes a plurality of first wordlinesextending in a first direction, a plurality of bitlines extending in asecond direction crossing the first direction, and a plurality of suchmemory cells at crossing regions of the first wordlines and thebitlines. In each memory cell, the first wordline is a corresponding oneof the first wordlines and the bitline is a corresponding one of thebitlines.

In another embodiment, an embedded memory includes a plurality of firstwordlines extending in a first direction, a plurality of bitlinesextending in a second direction crossing the first direction, and aplurality of embedded memory cells at crossing regions of the firstwordlines and the bitlines. Each of the embedded memory cells includes abackend thin-film transistor (TFT). The backend TFT is a ferroelectricfield-effect transistor (FeFET) including first and second gateelectrodes, source and drain regions, a semiconductor region between andphysically connecting the source and drain regions, a first gatedielectric between the semiconductor region and the first gateelectrode, and a second gate dielectric between the semiconductor regionand the second gate electrode. The first gate dielectric includes aferroelectric dielectric.

General Overview

In accordance with some embodiments of the present disclosure, an eNVMmemory cell includes a ferroelectric material incorporated as the gateoxide of a backend transistor, such as a backend thin-film transistor(TFT). The ferroelectric FET uses a ferroelectric material to store abit (logical 1 or 0) in the eNVM. The reading of the memory cell can bedestructive or nondestructive. Two different states (parallel oranti-parallel) of the ferroelectric FET can be sensed, for example, on abitline. For instance, by selecting the memory cell (e.g., using aunique combination of bitline and wordline, as driven by a controlcircuit such as a wordline driver), amplifying the bias (e.g., using asense amplifier) imparted by the ferroelectric FET on the bitline, andcomparing the amplified sensed bias to that of an unbiased bitline, thestate of the ferroelectric FET (e.g., parallel or anti-parallel) can bedetermined. Using a backend TFT, e.g., a TFT formed during a back end ofline (BEOL) process, the front end of line (FEOL) process can be used tofabricate the memory controller (e.g., wordline drivers, senseamplifiers, and the like) logic underneath the memory array. This allowsmore room for the ferroelectric FETs, allowing them to continue tofunction as memory devices even with smaller process technologies, suchas 14 nanometer (nm), 10 nm, 7 nm, 5 nm, and beyond.

Further, using a double-gated FeFET memory cell allows for flexible waysto operate the embedded memories created from such cells. For example,both gates can be independently driven (e.g., with different wordlines),allowing for such capabilities as writing to the memory cell using onewordline while reading from the memory cell using the other wordline, orwriting to the memory cell using both wordlines, or reading from thememory cell using either wordline, or reading from the memory cell usingboth wordlines. For instance, for programming selected cells sharing thesame wordline to an anti-parallel state (e.g., using correspondingbitlines to select the cells affected), a negative voltage can besupplied by the wordline whose gate is coupled to the ferroelectricdielectric, while a positive voltage can be supplied by the wordlinewhose gate is coupled to the non-ferroelectric dielectric. This createsa bigger negative bias in the selected cells than would be possible justdriving the wordline coupled to the ferroelectric dielectrics.

Architecture and Methodology

FIG. 1 is a cross-sectional (X-Z) view of an example ferroelectric fieldeffect transistor (FeFET) 100, according to an embodiment of the presentdisclosure. Throughout, the z-axis represents a vertical dimension(e.g., perpendicular to an integrated circuit substrate, while the x-and y-axes represent horizontal dimensions (e.g., parallel to thewordline and bitline directions, respectively). The components of FeFET100 can be fabricated using semiconductor fabrication techniques, suchas deposition and photolithography. The components of FeFET 100 can bepart of a backend process, such as the back end of line (BEOL) processof a semiconductor integrated circuit. As such, the components of FeFET100 can be fabricated as part of, or concurrently with, the metalinterconnection layers (such as the upper or middle metalinterconnection layers) of a semiconductor fabrication process. In someother embodiment, the components of FeFET are fabricated as a front endof line (FEOL) process.

In example embodiments, fabrication of the components of FeFET 100 canbe part of the metal 4 (interconnect) layer of a BEOL process, usingmostly a custom process (e.g., separate from the other metal 4 features)to form the components. Referring to FIG. 1, a first gate (or first gateelectrode) 110 is formed. The first gate 110 is conductive, and canrepresent one or more layers or features for supplying a first gatesignal to the FeFET 100. For instance, the first gate 110 can include afirst wordline (such as a first wordline made of copper (Cu) or aluminum(Al)) to supply a first gate signal from a first wordline driver, alongwith diffusion barriers and a first metal gate electrode for supplyingthe first gate signal to the proximity of the channel region of theFeFET 100.

For example, the first gate 110 can include thin-film layers such as oneor more first gate electrode layers (e.g., diffusion barrier and firstmetal gate layers). The diffusion barrier can be a metal- orcopper-diffusion barrier (e.g., a conductive material to reduce orprevent the diffusion of metal or copper from a wordline into the metalfirst gate 110 while still maintaining an electrical connection betweenthe first wordline and the metal first gate 110) on the first wordlinesuch as tantalum nitride (TaN), tantalum (Ta), titanium zirconiumnitride (e.g., TixZr_(1-x)N, such as X=0.53), titanium nitride (e.g.,TiN), titanium tungsten (TiW), combination (such as a stack structure ofTaN on Ta), or the like.

For instance, the diffusion barrier can include a single- or multi-layerstructure including a compound of tantalum(Ta) and nitrogen(N), such asTaN or a layer of TaN on a layer of Ta. In some embodiments, a layer ofetch-resistant material (e.g., etch stop) such as silicon nitride (e.g.,Si₃N₄) or silicon carbide (e.g., SiC) is formed over the first wordlinewith vias for a metal (or copper) diffusion barrier film such as TaN ora TaN/Ta stack. The first metal gate can be a conductive material on thediffusion barrier, such as metal, conductive metal oxide or nitride, orthe like. For example, in one embodiment, the first metal gate istitanium nitride (TiN). In another embodiment, the first metal gate istungsten (W).

The first gate 110 is covered with a ferroelectric dielectric 120corresponding to an active (semiconductor) layer 130 (or to a channelarea of the active layer) of the FeFET 100. The ferroelectric dielectric120 can be a ferroelectric material such as one or more of leadzirconate titanate (PZT), hafnium zirconium oxide (HZO), barium titanate(BaTiO₃), lead titanate (PbTiO₃), and doped hafnium dioxide (HfO₂). Thedoped HfO₂ can include one or more of silicon-doped HfO₂, yttrium-dopedHfO₂, and aluminum-doped HfO₂.

The semiconductive active layer 130 is formed over the ferroelectricdielectric 120. The active layer 130 can be formed in a backend process,for example, from one or more of indium gallium zinc oxide (IGZO),indium zinc oxide (IZO), amorphous silicon (a-Si), low-temperaturepolycrystalline silicon (LTPS), and amorphous germanium (a-Ge). Forexample, the active layer 130 can be IGZO or the like in contact with abitline (such as bitline 190, e.g., at a drain region 134 of the activelayer 130) and a source voltage 180 (e.g., at a source region 132 of theactive layer 130), with a semi-conductive channel region 136 between thedrain region 134 and the source region 132. Such an active layer channel136 may include only majority carriers in the thin film. Accordingly,the active layer channel 136 may require high bias (as supplied by thefirst wordline, diffusion barrier film, and first metal gate) toactivate. In addition to IGZO, in some embodiments, the active layer 130is one of a variety of polycrystalline semiconductors, including, forexample, zinc oxynitride (ZnON, such as a composite of zinc oxide (ZnO)and zinc nitride (Zn₃N₂), or of ZnO, ZnO_(x)N_(y), and Zn₃N₂), indiumtin oxide (ITO), tin oxide (e.g., SnO), copper oxide (e.g., Cu₂O),polycrystalline germanium (poly-Ge) silicon-germanium (e.g., SiGe, suchas Si_(1-x)Ge_(x)) structures (such as a stack of poly-Ge over SiGe),and the like.

In some embodiments, the active layer 130 is formed from first typechannel material, which may be an n-type channel material or a p-typechannel material. An n-type channel material may include indium tinoxide (ITO), indium gallium zinc oxide (IGZO), indium zinc oxide (IZO),aluminum-doped zinc oxide (AZO), amorphous silicon (a-Si), zinc oxide(e.g., ZnO), amorphous germanium (a-Ge), polycrystalline silicon(polysilicon or poly-Si), poly-germanium (poly-Ge), or poly- III-V likeindium arsenide (InAs). On the other hand, a p-type channel material mayinclude amorphous silicon, zinc oxide, amorphous germanium, polysilicon,poly germanium, poly- III-V like InAs, copper oxide (e.g., CuO), or tinoxide (e.g., SnO). The channel region 146 have a thickness in a range ofabout 10 nm to about 100 nm.

As mentioned, the active layer 130 can be divided into three differentregions, namely the source and drain regions 132 and 134 with thechannel region 136 between and physically connecting the source anddrain regions 132 and 134. The active layer 130 forms a transistordevice with the first gate 110 and ferroelectric dielectric 120. When agate signal is supplied to the first gate 110, the active layer 130becomes conductive, and current flows between the source and drainregions 132 and 134 via the channel region 136.

Further, in some embodiments (such as n-channel logic), when a positivecoercive voltage is applied to the first gate 110 (with respect to thechannel 136), the ferroelectric dielectric 120 becomes oriented in theparallel state. As such, the channel region 136 behaves as if a smallpositive voltage is always being applied from the ferroelectricdielectric. This allows the first gate 110 to drive the transistor withless voltage than when the ferroelectric dielectric 120 is unbiased(e.g., 50% parallel, 50% anti-parallel) or in the anti-parallel state.The opposite phenomenon takes place when a negative coercive voltage isapplied to the first gate 110 (with respect to the channel 136). Thenthe ferroelectric dielectric 120 becomes oriented in the anti-parallelstate, at which point more voltage from the first gate 110 is needed todrive the transistor than when the ferroelectric dielectric 120 isunbiased or in the parallel state. In p-channel logic, a similarphenomenon takes place, with the polarities reversed, as will beappreciated in light of this disclosure. For ease of description,n-channel logic will be discussed primarily throughout.

Above the active layer 130, a second gate structure is formed. In FIG.1, a gate dielectric 160 is formed on the channel region 136. The gatedielectric 160 can be a high-k dielectric material such as hafniumdioxide (HfO₂). The gate dielectric 160 can be thin, such as 4nanometers (nm). In some embodiments, the gate dielectric 160 is in arange of 3 nm to 7 nm. In some embodiments, the gate dielectric 160 isin a range of 2 nm to 10 nm. In some embodiments, the gate dielectric160 can be silicon dioxide (SiO₂), silicon nitride (e.g., Si₃N₄),hafnium dioxide (HfO₂) or other high-k material, or a multi-layer stackincluding a first layer of SiO₂ and a second layer of a high-kdielectric such as HfO₂ on the SiO₂. Any number of gate dielectrics canbe used, as will be appreciated in light of the present disclosure. Forexample, in one embodiment, the gate dielectric 160 is a layer of SiO₂.In another embodiment, the gate dielectric 160 is a stack (e.g., two ormore layers) of HfO₂ on SiO₂.

Above the gate dielectric 160, a second gate (such as a second gateelectrode) 170 is formed. The second gate 170 can be thin, as with thefirst metal gate of the first gate 110, and can be constructed ofsimilar materials or structures. The second gate 170 can be electricallyconnected to a second wordline that supplies a second gate signal (e.g.,from a second wordline driver). In some embodiments, the second gate 170can drive the transistor independently of the first gate 110. Forexample, the second gate 170 can be electrically separated from thefirst gate 110, and the second wordline can be electrically separatedfrom the first wordline, such that the second gate 170 can drive readoperations of the ferroelectric dielectric (e.g., by driving sensingcurrents), while the first gate 110 drives write operations. In someother embodiments, the second gate 170 is used to assist the first gate110 (e.g., to apply a reverse bias when programming the ferroelectricdielectric 120, or supplementing the first gate signal to betteractivate the transistor, such as when sensing the ferroelectricdielectric 120). In some embodiments, the first gate 110 is used towrite the ferroelectric dielectric 120, and the second gate 170 is usedto read the stored state of the ferroelectric dielectric 120.

In addition, above the active layer 130, a source electrode 140 isformed and electrically connected to the source region 132, a drainelectrode 150 is formed and electrically connected to the drain region134, and insulation 165 is formed between the source electrode 140 andthe gate dielectric 160 and second gate 170 stack, and between the drainelectrode 150 and the gate dielectric 160 and second gate 170 stack, toelectrically insulate the source and drain electrodes 140 and 150 fromthe gate dielectric 160 and second gate 170 stack. In some embodiments,the insulation 165 is an etch resistant insulation material, such assilicon nitride (e.g., Si₃N₄) or silicon carbide (e.g., SiC).

The source and drain electrodes 140 and 150 can be metal, such as metalinterconnect layer material (e.g., Cu, Al, or tungsten (W)). In someembodiments, the source and drain electrodes 140 and 150 are similar orthe same materials as those used to form the second gate 170. The FeFET100 acts as a memory (by programming the ferroelectric dielectric 120)and as a switch, electrically connecting the source and drain electrodes140 and 150 in response to a gate signal, such as a first gate signalbeing supplied to the first gate 110 or a second gate signal beingsupplied to the second gate 170.

A source voltage supply 180 (e.g., further metal interconnect material)such as a source supply line or plate is formed above and electricallyconnected to the source electrode 140. For example, the source voltage180 can be a ground voltage or other fixed voltage, or can be aprogrammable voltage used in conjunction with the bitline 190 in theread or write operations. Further, the bitline 190 (e.g., further metalinterconnect material) is formed above and electrically connected to thedrain electrode 150. The bitline 190 is used in combination with thesource voltage 180 to sense the state of the ferroelectric dielectric120 when used as a memory device. In other embodiments, the FeFET 100acts as a switch, controlling an electrical current between the bitline190 and the source voltage 180. In some embodiments, the roles of thesource and drain electrodes 140 and 150 are reversed, the sourceelectrode being connected to the bitline 190 and the drain electrodebeing connected to the source voltage (or drain voltage) 180.

FIG. 2 is a cross-sectional (X-Z) view of an example FeFET 200,according to another embodiment of the present disclosure. Here, theFeFET 200 has a similar structure to that of FeFET 100 in FIG. 1, butthe roles of the gate dielectrics are reversed. Accordingly, some of thecomponents are the same or similar between the two embodiments, and arenumbered the same. For ease of discussion, their descriptions may not berepeated. Further, the materials for similarly numbered or namedstructures can be substantially the same between the two embodiments.

For example, in FeFET 200, the first gate 210 can be similar to thefirst gate 110 in FeFET 100, with appropriate accommodations for formingthe gate dielectric 220 (such as a high-k dielectric) on the first gate210 (e.g., material compatibilities and the like). Further, the firstgate 210 in FeFET 200 has an operation role a lot closer to that of thesecond gate 170 in FeFET 100 than to the first gate 110 in FeFET 100,given the switched locations of the ferroelectric dielectric and thehigh-k dielectric between the two embodiments. Accordingly, the role ofthe first wordline driver (for supplying the first gate signal to thefirst wordline and to the first gate 210) in FeFET 200 may also bereversed compared to that of FeFET 100.

Similar to FeFET 100, FeFET 200 has an active layer 230 on the gatedielectric 220. The active layer 230 includes source and drain regions232 and 234, and a semiconductive channel region 236 between andphysically connecting the source and drain regions 232 and 234. Theferroelectric dielectric 260 is formed above the channel 236 (as part ofthe top gate structure), with the second gate 270 formed on theferroelectric dielectric 260. The second gate 270 can be driven by asecond wordline. The second wordline can be in a higher metalinterconnect layer than the first wordline (that drives the first gate210). For example, the first and second wordlines may extend in awordline direction in the fourth and sixth metal interconnect layers,respectively, while the bitline (and possibly a source line) extend in abitline direction in the fifth metal interconnect layer (between andcrossing first and second wordlines). The second wordline can beelectrically separated from the first wordline.

FIG. 3 is a cross-sectional (Y-Z) view of an example embedded memory300, according to an embodiment of the present disclosure. FIG. 3illustrates the Y and Z dimensions (width and height, respectively), theX dimension (length) extending into and out of the Y-Z plane. Theembedded memory 300 includes an FEOL 310 that includes most of thevarious logic layers, circuits, and devices to drive and control theintegrated circuit (e.g., chip) being fabricated with the embeddedmemory 300. As illustrated in FIG. 3, the embedded memory 300 alsoincludes a BEOL 320 including, in this case, seven metal interconnectionlayers (namely, metal 1 layer 325, metal 2 layer 330, metal 3 layer 335,metal 4 layer 340, metal 5 layer 345, metal 6 layer 350, and metal 7layer 355) to interconnect the various inputs and outputs of the FEOL310.

Generally speaking, each of the metal 1 layer 325 through the metal 7layer 355 includes a via portion and an interconnect portion locatedabove the via portion, the interconnect portion being for transferringsignals along metal lines extending in the X or Y directions, the viaportion being for transferring signals through metal vias extending inthe Z direction (such as to the next lower metal layer underneath).Accordingly, vias connect metal structures (e.g., metal lines or vias)from one metal layer to metal structures of the next lower metal layer.Further, each of the metal 1 layer 325 through the metal 7 layer 355includes a pattern of conductive metal, such as copper (Cu) or aluminum(Al), formed in a dielectric medium or interlayer dielectric (ILD), suchas by photolithography.

In addition, the embedded memory 300 is further divided into a memoryarray 390 (e.g., an eNVM memory array) built in the metal 4 layer 340through the metal 6 layer 350 and including the FeFETs (in the metal 5layer 345) as well as the first wordlines (e.g., row selectors, fordriving the first gates, in the metal 4 layer 340), second wordlines(e.g., also row selectors, for driving the second gates, in the metal 6layer 350), and the bitlines (e.g., column selectors, in the metal 5layer 345) and possible source lines (also in the metal 5 layer 345)making up the eNVM memory cells, and a memory peripheral circuit 380built in the FEOL and metal 1 layer 325 through metal 3 layer 335 tocontrol (e.g., access, store, refresh) the memory array 390.

Compared to other techniques that locate such a memory control circuitin the same layers as the memory array but in a different macro (or X-Y)area of the integrated circuit than the memory array (such as at aperiphery of the memory array), the embedded memory 300 locates thememory peripheral circuit 380 below the memory array 390 (e.g., in thesame X-Y area). This saves valuable X-Y area in the finished integratedcircuit. In further detail, the embedded memory 300 embeds the FeFETs(e.g., backend TFTs) in the metal 5 layer 345 (such as the via portionof the metal 5 layer 345). For example, the metal 4 layer 340 cancontain the first wordlines extending in the X direction to select a rowof memory cells (bits), the metal 5 layer 345 can contain the bitlinesextending in the Y direction to sense each of the memory cells (bits) inthe selected row, and the metal 6 layer 350 can contain the secondwordlines extending in the X direction to further process the selectedrow (e.g., to write, assist in writing, read, or assist in readingmemory data to the ferroelectric dielectric of any of the memory cellsin the selected row). The FeFETs can be fabricated in the metal 5 layer345, above the wordlines (that serve as or connect to the gateelectrodes or contacts) and below the bitlines (that serve as the drainelectrodes or contacts, or in some embodiments, serve as the sourceelectrodes or contacts). For example, the FeFET can have the firsttransistor gate below the thin-film layer (that can be formed at thebottom of the metal 5 layer 345, such as in the via portion) and sourceand drain contacts above the thin-film layer.

In further detail, in some embodiments, the lower or first metal gate ofthe FeFET in each memory cell can be connected to a continuous metal 4line below, such as a copper (Cu)-based metal line, which provides muchlower resistance compared to gate lines formed in the lower (e.g., FEOL)portions of the integrated circuit. The continuous metal 4 line is usedas the first wordline of the memory array, and is covered by diffusionbarriers or diffusion barrier layers including dielectric layers, suchas silicon nitride (e.g., Si₃N₄), silicon carbide (e.g., SiC), or thelike, with vias filled with metal-diffusion barrier films like tantalumnitride (TaN), tantalum (Ta), titanium zirconium nitride (e.g.,TixZr_(1-x)N, such as X=0.53), titanium nitride (e.g., TiN), titaniumtungsten (TiW), or the like. A first metal gate layer covers thediffusion barrier film-filled vias, which electrically connect thecopper (Cu) wordline to the metal gates of the selector TFTs, thediffusion barrier film preventing or helping to prevent the diffusion ormigration of copper (Cu) from the first wordline to the rest of theselector TFTs. An active thin-film layer (e.g., indium gallium zincoxide, or IGZO) and then source and drain contacts above the thin-filmlayer use the metal 5 layer 345. The space between the source and draincontacts determines the gate length of the selector transistor.

FIG. 4 is an example voltage curve comparison for driving a FeFET inthree different states, according to an embodiment of the presentdisclosure. Three different curves are illustrated in FIG. 4: unbiasedcurve 400, 100% parallel curve 420, and 100% anti-parallel curve 410.The x-axis of FIG. 4 tracks the gate-to-source voltage V_(gs) of theFeFET (increasing to the right, with 0 volts at the intersection withthe y-axis), while the y-axis tracks the base 10 logarithm of thecorresponding drain-to-source current IDS corresponding to the gatevoltage V_(gs). Three different voltages are identified on the unbiasedcurve 400 (and exist in similar locations on the other two curves): thegate off voltage V_(off) (e.g., the voltage at which the FeFET iseffectively off, such as when supplying minimal current), the gate onvoltage V_(on) (e.g., the voltage at which the FeFET is fully on, suchas when supplying maximal current), and the threshold voltage V_(th)(e.g., the voltage at which the channel region between the source anddrain regions becomes a conductive channel).

In FIG. 4, the unbiased curve 400 represents the normal operation of aMOSFET (e.g., an n-channel MOSFET). However, the orienting of theferroelectric dielectric in the FeFET has the effect of shifting theunbiased curve 400 either left or right, depending on the orientation ofthe ferroelectric lattices. For example, when the lattices are 100%parallel, it has the effect of shifting the voltage curve to the left(to the 100% parallel curve 420), similar to a positive gate voltagebeing permanently applied to the gate electrode. Likewise, when thelattices are 100% anti-parallel, it has the effect of shifting thevoltage curve to the right (to the 100% anti-parallel curve 410),similar to a negative gate voltage being permanently applied to the gateelectrode.

FIG. 5 is a schematic plan (X-Y) view of an example embedded memoryconfiguration, according to an embodiment of the present disclosure. Thememory array configuration of FIG. 5 includes memory cells 550 atcrossing regions of first wordlines 515, second wordlines 525, andbitlines 190 (e.g., each memory cell 550 being driven by a unique set offirst and second wordlines 515 and 525, and bitline 190). Each memorycell 550 includes a FeFET 100. Each first wordline 515 is selected by acorresponding first wordline driver 510 and each second wordline 525 isselected by a corresponding second wordline driver 540, while thecorresponding bitlines 190 are used to sense the state of theferroelectric material (e.g., parallel or anti-parallel) in the FeFET100 of each of the corresponding bits of the selected first wordline 510and second wordline 540. In some embodiments, a reference column ofmemory cells provides a corresponding reference signal (e.g., halfwaybetween a logic low value and a logic high value) over a referencebitline 520 concurrently with the sensing of the desired bit on thebitline 190. These two values are compared, by a sense amplifier 530,which determines whether the desired bit is a logic high value (e.g., 1)or a logic low value (e.g., 0).

The memory cells 550 can be embedded in BEOL layers (such as the highermetal interconnect layers of the BEOL) while the peripheral circuitsresponsible for memory operation, including the read sense amplifiers530 (and other bitline driver circuits) and first and second wordlinedriver circuits 510 and 540, are placed below the memory array (e.g., inthe FEOL and lower metal interconnect layers of the BEOL) to reduce areaof the embedded memory.

FIG. 6A is a plan (Y-X) view of an example layout of an embedded memorywithout overlap of the memory array 390 and memory peripheral circuit(illustrated as first and second wordline drivers 510 and 540, andcolumn circuits 610). FIGS. 6B-6C are plan (Y-X) views of an examplelayout or floorplan of an embedded memory with overlap of the memoryarray 390 and memory peripheral circuits 510, 540, and 610, according toan embodiment of the present disclosure.

The column circuits 610 (or bitline drivers) include devices such asread (bitline) sense amplifiers 530 and precharging circuits. FIG. 6Ashows the circuits spread out (e.g., occupying FEOL macro area or CMOSlogic transistor area) and without overlap. By contrast, FIG. 6B showsthe memory array 390 occupying the higher metal interconnection layersof the BEOL 320 (as illustrated in FIG. 3) and FIG. 6C shows the memoryperipheral circuits 510, 540, and 610 occupying the FEOL 310 and lowermetal interconnection layers of the BEOL 320 underneath the memory array390 (as illustrated in FIG. 3). Since more than 35% of the embeddedmemory macro area can be consumed by the peripheral (memory control)circuits, substantial savings of X-Y macro area can be saved byfabricating the memory arrays above the memory peripheral circuits, asin one or more embodiments of the present disclosure. Put another way,according to some embodiments of the present disclosure, an embeddedmemory is provided with memory cells only using space in the upper metallayers (e.g., metal 4 layer and above), the peripheral circuits beingmoved below the memory cells (e.g., in metal 3 layer and below,including the FEOL) and substantially reduce the memory area.

FIG. 7 illustrates an example method 700 of fabricating a FeFET-basedembedded memory (e.g., an eNVM), according to an embodiment of thepresent disclosure. This and other methods disclosed herein may becarried out using integrated circuit fabrication techniques such asphotolithography as would be apparent in light of the presentdisclosure. The corresponding nonvolatile memory cell and embeddedmemory including the memory cells may be part of other (logic) deviceson the same substrate, such as application specific integrated circuits(ASICs), microprocessors, central processing units, processing cores,and the like. Unless otherwise described herein, verbs such as “coupled”or “couple” refer to an electrical coupling (such as capable oftransmitting an electrical signal), either directly or indirectly (suchas through one or more conductive layers in between).

Referring to FIG. 7 (with specific example references to the structuresof FIGS. 1-6) method 700 includes forming 710 a plurality of firstwordlines (such as first wordlines 515) extending in a first direction(such as an X-direction), forming 720 a plurality of bitlines (such asbitlines 190) extending in a second direction (such as a Y-direction)crossing the first direction, and forming 730 a plurality of embeddedmemory cells (such as memory cells 550) at crossing regions (see FIG. 5)of the first wordlines and the bitlines. The method 700 furtherincludes, for each embedded memory cell, forming 740 a backend TFTincluding a FeFET (such as FeFET 100). The method 700 further includes,for each FeFET, forming 750 a first gate electrode (such as first gate110), forming a first gate dielectric (such as ferroelectric 120) on thefirst gate electrode, and forming an active layer (such as active layer130) on the first gate dielectric, the active layer including source anddrain regions (such as source and drain regions 132 and 134), and asemiconductor region (such as channel region 136) between the source anddrain regions.

The method 700 further includes, for each FeFET, forming 760 a secondgate dielectric (such as high-k dielectric 160) on the semiconductorregion, and forming a second gate electrode (such as 2nd gate 170) onthe second gate dielectric. One of the first and second gate dielectricsincludes a ferroelectric dielectric. The method 700 further includeselectrically connecting 770 the one of the first and second gateelectrodes to a corresponding one of the first wordlines, andelectrically connecting 780 one of the source and drain regions to acorresponding one of the bitlines.

While the above example methods appear as a series of operations orstages, it is to be understood that there is no required order to theoperations or stages unless specifically indicated. For example, invarious embodiments of method 700, for each memory cell, theelectrically connecting 770 of the one of the first and second gateelectrodes to a corresponding one of the first wordlines can take placebefore, during, or after the electrically connecting 780 of the one ofthe source and drain regions to a corresponding one of the bitlines.

Example System

FIG. 8 illustrates a computing system 1000 implemented with theintegrated circuit structures or techniques disclosed herein, accordingto an embodiment of the present disclosure. As can be seen, thecomputing system 1000 houses a motherboard 1002. The motherboard 1002may include a number of components, including, but not limited to, aprocessor 1004 (including embedded memory) and at least onecommunication chip 1006, each of which can be physically andelectrically coupled to the motherboard 1002, or otherwise integratedtherein. As will be appreciated, the motherboard 1002 may be, forexample, any printed circuit board, whether a main board, adaughterboard mounted on a main board, or the only board of system 1000,to name a few examples.

Depending on its applications, computing system 1000 may include one ormore other components that may or may not be physically and electricallycoupled to the motherboard 1002. These other components may include, butare not limited to, volatile memory (e.g., DRAM), nonvolatile memory(e.g., read-only memory (ROM), resistive random-access memory (RRAM),and the like), a graphics processor, a digital signal processor, acrypto (or cryptographic) processor, a chipset, an antenna, a display, atouchscreen display, a touchscreen controller, a battery, an audiocodec, a video codec, a power amplifier, a global positioning system(GPS) device, a compass, an accelerometer, a gyroscope, a speaker, acamera, and a mass storage device (such as hard disk drive, compact disk(CD), digital versatile disk (DVD), and so forth). Any of the componentsincluded in computing system 1000 may include one or more integratedcircuit structures or devices (e.g., one or more memory cells) formedusing the disclosed techniques in accordance with an example embodiment.In some embodiments, multiple functions can be integrated into one ormore chips (e.g., for instance, note that the communication chip 1006can be part of or otherwise integrated into the processor 1004).

The communication chip 1006 enables wireless communications for thetransfer of data to and from the computing system 1000. The term“wireless” and its derivatives may be used to describe circuits,devices, systems, methods, techniques, communications channels, and thelike, that may communicate data through the use of modulatedelectromagnetic radiation through a non-solid medium. The term does notimply that the associated devices do not contain any wires, although insome embodiments they might not. The communication chip 1006 mayimplement any of a number of wireless standards or protocols, including,but not limited to, Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16family), IEEE 802.20, long term evolution (LTE), Ev-DO, HSPA+, HSDPA+,HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, derivativesthereof, as well as any other wireless protocols that are designated as3G, 4G, 5G, and beyond. The computing system 1000 may include aplurality of communication chips 1006. For instance, a firstcommunication chip 1006 may be dedicated to shorter range wirelesscommunications such as Wi-Fi and Bluetooth and a second communicationchip 1006 may be dedicated to longer range wireless communications suchas GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others.

The processor 1004 of the computing system 1000 includes an integratedcircuit die packaged within the processor 1004. In some embodiments, theintegrated circuit die of the processor includes onboard circuitry thatis implemented with one or more integrated circuit structures or devices(e.g., one or more memory cells) formed using the disclosed techniques,as variously described herein. The term “processor” may refer to anydevice or portion of a device that processes, for instance, electronicdata from registers and/or memory to transform that electronic data intoother electronic data that may be stored in registers and/or memory.

The communication chip 1006 also may include an integrated circuit diepackaged within the communication chip 1006. In accordance with somesuch example embodiments, the integrated circuit die of thecommunication chip includes one or more integrated circuit structures ordevices (e.g., one or more memory cells) formed using the disclosedtechniques as variously described herein. As will be appreciated inlight of this disclosure, note that multi-standard wireless capabilitymay be integrated directly into the processor 1004 (e.g., wherefunctionality of any chips 1006 is integrated into processor 1004,rather than having separate communication chips). Further note thatprocessor 1004 may be a chip set having such wireless capability. Inshort, any number of processor 1004 and/or communication chips 1006 canbe used. Likewise, any one chip or chip set can have multiple functionsintegrated therein.

In various implementations, the computing device 1000 may be a laptop, anetbook, a notebook, a smartphone, a tablet, a personal digitalassistant (PDA), an ultra-mobile PC, a mobile phone, a desktop computer,a server, a printer, a scanner, a monitor, a set-top box, anentertainment control unit, a digital camera, a portable music player, adigital video recorder, or any other electronic device that processesdata or employs one or more integrated circuit structures or devices(e.g., one or more memory cells) formed using the disclosed techniques,as variously described herein.

FURTHER EXAMPLE EMBODIMENTS

The following examples pertain to further embodiments, from whichnumerous permutations and configurations will be apparent.

Example 1 is a ferroelectric field-effect transistor (FeFET) including:first and second gate electrodes; source and drain regions; asemiconductor region between and physically connecting the source anddrain regions; a first gate dielectric between the semiconductor regionand the first gate electrode, the first gate dielectric including aferroelectric dielectric; and a second gate dielectric between thesemiconductor region and the second gate electrode.

Example 2 includes the FeFET of Example 1, where the first and secondgate electrodes are electrically separated.

Example 3 includes the FeFET of any of Examples 1-2, where thesemiconductor region includes one or more of indium gallium zinc oxide(IGZO), indium zinc oxide (IZO), indium tin oxide (ITO), amorphoussilicon (a-Si), zinc oxide, polysilicon, poly-germanium, low-temperaturepolycrystalline silicon (LTPS), amorphous germanium (a-Ge), indiumarsenide, copper oxide, and tin oxide.

Example 4 includes the FeFET of Example 3, where the semiconductorregion includes one or more of IGZO, IZO, a-Si, LTPS, and a-Ge.

Example 5 includes the FeFET of any of Examples 1-4, where theferroelectric dielectric includes one or more of lead zirconate titanate(PZT), hafnium zirconium oxide (HZO), barium titanate (BaTiO₃), leadtitanate (PbTiO₃), and doped hafnium dioxide (HfO₂).

Example 6 includes the FeFET of Example 5, where the doped HfO₂ includesone or more of silicon-doped HfO₂, yttrium-doped HfO₂, andaluminum-doped HfO₂.

Example 7 includes the FeFET of any of Examples 1-6, where the secondgate dielectric includes a high-k dielectric.

Example 8 includes the FeFET of Example 7, where the high-k dielectricincludes hafnium dioxide (HfO₂).

Example 9 includes the FeFET of Example 8, where the second gatedielectric has a thickness between 2 and 10 nanometers (nm).

Example 10 is a memory cell including the FeFET of any of Examples 1-9,the first gate electrode being electrically connected to a firstwordline and one of the source and drain regions being electricallyconnected to a bitline.

Example 11 includes the memory cell of Example 10, where the second gateelectrode is electrically connected to a second wordline electricallyseparated from the first wordline.

Example 12 is a memory array including a plurality of first wordlinesextending in a first direction, a plurality of bitlines extending in asecond direction crossing the first direction, and a plurality of memorycells at crossing regions of the first wordlines and the bitlines, thememory cells including a first memory cell and a second memory cell,each of the first and second memory cells having a structure of thememory cell of any of Examples 10-11, with the first wordline being acorresponding one of the first wordlines and the bitline being acorresponding one of the bitlines.

Example 13 includes the memory array of Example 12, further including aplurality of second wordlines extending in the first direction andelectrically separated from the first wordlines, where the second gateelectrode in each of first and second memory cells is electricallyconnected to a corresponding one of the second wordlines.

Example 14 is a backend thin-film transistor (TFT) including the FeFETof any of Examples 1-9, the backend TFT being electrically connected toa frontend circuit.

Example 15 is an embedded memory cell including the backend TFT ofExample 14, the first gate electrode being electrically connected to afirst wordline and one of the source and drain regions beingelectrically connected to a bitline.

Example 16 includes the embedded memory cell of Example 15, where thesecond gate electrode is electrically connected to a second wordlineelectrically separated from the first wordline.

Example 17 includes the embedded memory cell of any of Examples 15-16,where the frontend circuit includes a wordline driver electricallyconnected to the first wordline and a sense amplifier electricallyconnected to the bitline.

Example 18 is an embedded memory including a plurality of firstwordlines extending in a first direction, a plurality of bitlinesextending in a second direction crossing the first direction, and aplurality of embedded memory cells at crossing regions of the firstwordlines and the bitlines, the embedded memory cells including a firstembedded memory cell and a second embedded memory cell, each of thefirst and second embedded memory cells having a structure of theembedded memory cell of any of Examples 15-17, with the first wordlinebeing a corresponding one of the first wordlines and the bitline being acorresponding one of the bitlines.

Example 19 includes the embedded memory of Example 18, further includinga plurality of second wordlines extending in the first direction andelectrically separated from the first wordlines, where the second gateelectrode in each of the first and second embedded memory cells iselectrically connected to a corresponding one of the second wordlines.

Example 20 includes the embedded memory of any of Examples 18-19, wherethe frontend circuit includes a plurality of wordline driverselectrically connected to the first wordlines and a plurality of senseamplifiers electrically connected to the bitlines.

Example 21 is an embedded memory including: a plurality of firstwordlines extending in a first direction; a plurality of bitlinesextending in a second direction crossing the first direction; and aplurality of embedded memory cells at crossing regions of the firstwordlines and the bitlines, the embedded memory cells including a firstembedded memory cell and a second embedded memory cell, each of thefirst and second embedded memory cells including a backend thin-filmtransistor (TFT) electrically connected to a frontend circuit, thebackend TFT being a ferroelectric field-effect transistor (FeFET)including a first gate electrode electrically connected to acorresponding one of the first wordlines, a second gate electrode,source and drain regions, one of the source and drain regions beingelectrically connected to a corresponding one of the bitlines, asemiconductor region between and physically connecting the source anddrain regions, a first gate dielectric between the semiconductor regionand the first gate electrode, the first gate dielectric including aferroelectric dielectric, and a second gate dielectric between thesemiconductor region and the second gate electrode.

Example 22 includes the embedded memory of Example 21, where the firstand second gate electrodes are electrically separated.

Example 23 includes the embedded memory of any of Examples 21-22, wherethe semiconductor region includes one or more of indium gallium zincoxide (IGZO), indium zinc oxide (IZO), indium tin oxide (ITO), amorphoussilicon (a-Si), zinc oxide, polysilicon, poly-germanium, low-temperaturepolycrystalline silicon (LTPS), amorphous germanium (a-Ge), indiumarsenide, copper oxide, and tin oxide.

Example 24 includes the embedded memory of Example 23, where thesemiconductor region includes one or more of IGZO, IZO, a-Si, LTPS, anda-Ge.

Example 25 includes the embedded memory of any of Examples 21-24, wherethe ferroelectric dielectric includes one or more of lead zirconatetitanate (PZT), hafnium zirconium oxide (HZO), barium titanate (BaTiO₃),lead titanate (PbTiO₃), and doped hafnium dioxide (HfO₂).

Example 26 includes the embedded memory of Example 25, where the dopedHfO₂ includes one or more of silicon-doped HfO₂, yttrium-doped HfO₂, andaluminum-doped HfO₂.

Example 27 includes the embedded memory of any of Examples 21-26, thesecond gate dielectric includes a high-k dielectric.

Example 28 includes the embedded memory of Example 27, where the high-kdielectric includes hafnium dioxide (HfO₂).

Example 29 includes the embedded memory of Example 28, where the secondgate dielectric has a thickness between 2 and 10 nanometers (nm).

Example 30 includes the embedded memory of any of Examples 21-29,further including a plurality of second wordlines extending in the firstdirection and electrically separated from the first wordlines, where thesecond gate electrode in each of the first and second embedded memorycells is electrically connected to a corresponding one of the secondwordlines.

Example 31 includes the embedded memory of any of Examples 21-30, wherethe frontend circuit includes a plurality of wordline driverselectrically connected to the first wordlines and a plurality of senseamplifiers electrically connected to the bitlines.

Example 32 is a method of fabricating a ferroelectric field-effecttransistor (FeFET), the method including: forming a first gateelectrode; forming a first gate dielectric on the first gate electrode;forming an active layer on the first gate dielectric, the active layerincluding source and drain regions, and a semiconductor region betweenthe source and drain regions; forming a second gate dielectric on thesemiconductor region; and forming a second gate electrode on the secondgate dielectric, where one of the first and second gate dielectricsincludes a ferroelectric dielectric.

Example 33 includes the method of Example 32, where the first and secondgate electrodes are electrically separated.

Example 34 includes the method of any of Examples 32-33, where thesemiconductor region includes one or more of indium gallium zinc oxide(IGZO), indium zinc oxide (IZO), indium tin oxide (ITO), amorphoussilicon (a-Si), zinc oxide, polysilicon, poly-germanium, low-temperaturepolycrystalline silicon (LTPS), amorphous germanium (a-Ge), indiumarsenide, copper oxide, and tin oxide.

Example 35 includes the method of Example 34, where the semiconductorregion includes one or more of IGZO, IZO, a-Si, LTPS, and a-Ge.

Example 36 includes the method of any of Examples 32-35, where theferroelectric dielectric includes one or more of lead zirconate titanate(PZT), hafnium zirconium oxide (HZO), barium titanate (BaTiO₃), leadtitanate (PbTiO₃), and doped hafnium dioxide (HfO₂).

Example 37 includes the method of Example 36, where the doped HfO₂includes one or more of silicon-doped HfO₂, yttrium-doped HfO₂, andaluminum-doped HfO₂.

Example 38 includes the method of any of Examples 32-37, where anotherof first and second gate dielectrics includes a high-k dielectric.

Example 39 includes the method of Example 38, where the high-kdielectric includes hafnium dioxide (HfO₂).

Example 40 includes the method of Example 39, where the other of thefirst and second gate dielectrics has a thickness between 2 and 10nanometers (nm).

Example 41 is a method of fabricating a memory cell, the methodincluding fabricating the FeFET by the method of any of Examples 32-40,the one of the first and second gate dielectrics being between thesemiconductor region and one of the first and second gate electrodes;electrically connecting the one of the first and second gate electrodesto a first wordline; and electrically connecting one of the source anddrain regions to a bitline.

Example 42 includes the method of Example 41, further includingelectrically connecting another of the first and second gate electrodesto a second wordline electrically separated from the first wordline.

Example 43 is a method of fabricating a memory array the methodincluding: forming a plurality of first wordlines extending in a firstdirection; forming a plurality of bitlines extending in a seconddirection crossing the first direction; and forming a plurality ofmemory cells at crossing regions of the first wordlines and thebitlines, the memory cells including a first memory cell and a secondmemory cell, each of the first and second memory cells being fabricatedby the method of any of Examples 41-42, with the first wordline being acorresponding one of the first wordlines and the bitline being acorresponding one of the bitlines.

Example 44 includes the method of Example 43, further including: forminga plurality of second wordlines extending in the first direction andelectrically separated from the first wordlines; and for each of thefirst and second memory cells, electrically connecting another of thefirst and second gate electrodes to a corresponding one of the secondwordlines.

Example 45 is a method of fabricating a backend thin-film transistor(TFT), the method including: fabricating the FeFET by the method of anyof Examples 32-40, each of the first and second gate dielectrics and theactive layer being formed by a thin-film process in a backend portion ofan integrated circuit; and electrically connecting the backend TFT to afrontend circuit.

Example 46 is a method of forming an embedded memory cell including:forming the backend TFT by the method of Example 45, the one of thefirst and second gate dielectrics being between the semiconductor regionand one of the first and second gate electrodes; electrically connectingthe one of the first and second gate electrodes to a first wordline; andelectrically connecting one of the source and drain regions to abitline.

Example 47 includes the method of Example 46, further includingelectrically connecting another of the first and second gate electrodesto a second wordline electrically separated from the first wordline.

Example 48 includes the method of any of Examples 46-47, furtherincluding: forming a wordline driver as part of the frontend circuit;forming a sense amplifier as part of the frontend circuit; electricallyconnecting the wordline driver to the first wordline; and electricallyconnecting the sense amplifier to the bitline.

Example 49 is a method of fabricating an embedded memory, the methodincluding: forming a plurality of first wordlines extending in a firstdirection; forming a plurality of bitlines extending in a seconddirection crossing the first direction; and forming a plurality ofembedded memory cells at crossing regions of the first wordlines and thebitlines, the embedded memory cells including a first embedded memorycell and a second embedded memory cell, each of the first and secondembedded memory cells being fabricated by the method of any of Examples46-48, with the first wordline being a corresponding one of the firstwordlines and the bitline being a corresponding one of the bitlines.

Example 50 includes the method of Example 49, further including: forminga plurality of second wordlines extending in the first direction andelectrically separated from the first wordlines; and for each of thefirst and second embedded memory cells, electrically connecting anotherof the first and second gate electrodes to a corresponding one of thesecond wordlines.

Example 51 includes the method of any of Examples 49-50, furtherincluding: forming a plurality of wordline drivers as part of thefrontend circuit; forming a plurality of sense amplifiers as part of thefrontend circuit; electrically connecting the wordline drivers to thefirst wordlines; and electrically connecting the sense amplifiers to thebitlines.

The foregoing description of example embodiments has been presented forthe purposes of illustration and description. It is not intended to beexhaustive or to limit the present disclosure to the precise formsdisclosed. Many modifications and variations are possible in light ofthis disclosure. It is intended that the scope of the present disclosurebe limited not by this detailed description, but rather by the claimsappended hereto. Future filed applications claiming priority to thisapplication may claim the disclosed subject matter in a differentmanner, and may generally include any set of one or more limitations asvariously disclosed or otherwise demonstrated herein.

What is claimed is:
 1. A ferroelectric field-effect transistor (FeFET),comprising: first and second gate electrodes; source and drain regions;a region between and physically connecting the source and drain regions,the region comprising semiconductor material; a first gate dielectricbetween the region and the first gate electrode, the first gatedielectric comprising a ferroelectric dielectric, and the first gatedielectric having a first lateral width; and a second gate dielectricbetween the region and the second gate electrode, the second gatedielectric having a second lateral width, the second lateral widthdifferent than the first lateral width.
 2. The FeFET of claim 1, whereinthe second lateral width is less than the first lateral width.
 3. TheFeFET of claim 1, wherein the second gate dielectric is not aferroelectric dielectric.
 4. The FeFET of claim 1, wherein the first andsecond gate electrodes are electrically separated.
 5. The FeFET of claim1, wherein the region comprises one or more of indium, gallium, zinc,oxygen, tin, amorphous silicon (a-Si), polysilicon, poly-germanium,low-temperature polycrystalline silicon (LTPS), amorphous germanium(a-Ge), arsenic, or copper.
 6. The FeFET of claim 1, wherein theferroelectric dielectric comprises one or more of lead, zirconium,titanium, hafnium, barium, or lead.
 7. The FeFET of claim 1, wherein theferroelectric dielectric is doped with one or more of silicon, yttrium,or aluminum.
 8. The FeFET of claim 1, wherein the second gate dielectriccomprises a high-k dielectric, wherein the high-k dielectric compriseshafnium and oxygen, and wherein the second gate dielectric has athickness between 2 and 10 nanometers (nm).
 9. A memory cell comprisingthe FeFET of claim 1, the first gate electrode being electricallyconnected to a first wordline and one of the source and drain regionsbeing electrically connected to a bitline.
 10. The memory cell of claim9, wherein the second gate electrode is electrically connected to asecond wordline electrically separated from the first wordline.
 11. Amemory array comprising a plurality of first wordlines extending in afirst direction, a plurality of bitlines extending in a second directioncrossing the first direction, and a plurality of memory cells atcrossing regions of the first wordlines and the bitlines, the memorycells including a first memory cell and a second memory cell, each ofthe first and second memory cells having a structure of the memory cellof claim 8, with the first wordline being a corresponding one of thefirst wordlines and the bitline being a corresponding one of thebitlines.
 12. The memory array of claim 11, further comprising aplurality of second wordlines extending in the first direction andelectrically separated from the first wordlines, wherein the second gateelectrode in each of first and second memory cells is electricallyconnected to a corresponding one of the second wordlines.
 13. A backendthin-film transistor (TFT) comprising the FeFET of claim 1, the backendTFT being electrically connected to a frontend circuit.
 14. An embeddedmemory cell comprising the backend TFT of claim 13, the first gateelectrode being electrically connected to a first wordline and one ofthe source and drain regions being electrically connected to a bitline.15. The embedded memory cell of claim 14, wherein the second gateelectrode is electrically connected to a second wordline electricallyseparated from the first wordline.
 16. The embedded memory cell of claim14, wherein the frontend circuit comprises a wordline driverelectrically connected to the first wordline and a sense amplifierelectrically connected to the bitline.
 17. An embedded memory comprisinga plurality of wordlines extending in a first direction and including afirst wordline and a second wordline, a plurality of bitlines extendingin a second direction and including a first bitline and a secondbitline, a first memory cell at a first crossing region of the firstwordline and the first bitline, and a second memory cell at a secondcrossing region of the second wordline and the second bitline, each ofthe first and second memory cells having a structure of the embeddedmemory cell of claim
 14. 18. The embedded memory of claim 17, whereinthe plurality of wordlines is a first plurality of wordlines, theembedded memory further comprising a second plurality of wordlinesextending in the first direction and electrically separated from thefirst plurality of wordlines, wherein the second gate electrode in eachof the first and second embedded memory cells is electrically connectedto a corresponding one of the second plurality of wordlines.
 19. Theembedded memory of claim 17, wherein the frontend circuit comprisesfirst and second wordline drivers electrically connected to the firstand second wordlines, and first and second sense amplifiers electricallyconnected to the first and second bitlines.
 20. An integrated circuitstructure, comprising: a source region and a drain region; a body ofsemiconductor material between the source and drain regions; a firstgate stack on a first side of the body, the first gate stack including afirst gate dielectric comprising a ferroelectric dielectric, and thefirst gate dielectric having a first lateral width; and a second gatestack on a second side of the body, the second side opposite the firstside, the second gate stack including a second gate dielectriccomprising a high-κ dielectric, the second gate dielectric having asecond lateral width, the second lateral width different than the firstlateral width.
 21. The integrated circuit structure of claim 20, whereinthe second lateral width is less than the first lateral width.
 22. Theintegrated circuit structure of claim 20, wherein the first gate stackcomprises a first gate electrode, the second gate stack comprises asecond gate electrode, and the first and second gate electrodes areelectrically separated.
 23. A memory cell comprising the integratedcircuit structure of claim 22, wherein the first gate electrode iselectrically connected to a first wordline and one of the source anddrain regions is electrically connected to a bitline, and wherein thesecond gate electrode is electrically connected to a second wordlineelectrically separated from the first wordline.
 24. A computing device,comprising: a board; and a component coupled to the board, the componentincluding a ferroelectric field-effect transistor (FeFET), the FeFETcomprising: first and second gate electrodes; source and drain regions;a region between and physically connecting the source and drain regions,the region comprising semiconductor material; a first gate dielectricbetween the region and the first gate electrode, the first gatedielectric comprising a ferroelectric dielectric, and the first gatedielectric having a first lateral width; and a second gate dielectricbetween the region and the second gate electrode, the second gatedielectric having a second lateral width, the second lateral widthdifferent than the first lateral width.
 25. The computing device ofclaim 24, further comprising: a memory coupled to the board.